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Custom Interconnects
Typical Performance
Bandwidth: >100 GHz
Insertion Loss: <1 dB to 98 GHz
Self Inductance: 0.12 nH
Cycle Life: >100,000 Cycles
Contact Resistance: 4.8 milliohms
Continuous Current: 10.84 A
Pkg. Types: LGA or QFN
Fabrication Capabilities
Min. Bump Pitch: 0.5 mm
Min. Bump Diameter: 0.25 mm
Min. Via Diameter: 0.15 mm
Min. Line/Space Resolution: 0.15/0.15mm
Min. Laminate Thickness: 0.1mm Core
Continuous Operating Temp (C): (Laminate Dependant)
Bump Shape: Any