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Custom Interconnects
Typical Performance
Bandwidth: >100 GHz
Insertion Loss: <1 dB to 98 GHz
Self Inductance: 0.12 nH
Cycle Life: >100,000 Cycles
Contact Resistance: 4.8 milliohms
Continuous Current: 10.84 A
Pkg. Types: LGA or QFN
Fabrication Capabilities
Standard
Min. Bump Pitch: 0.6 mm
Min. Bump Diameter: 0.3 mm
Min. Via Diameter: 0.2 mm
Line and Space Resolution: 0.15/0.15mm
Min. Laminate Thickness: 0.1mm Core
Continuous Operating Temp (C): -55 to + 160
Experimental
Min. Bump Pitch: 0.25 mm
Min. Bump Diameter: 0.125 mm
Min. Via Diameter: 0.075 mm
Line and Space Resolution: 0.075/0.075mm
Min. Laminate Thickness: 0.05 mm Core
Continuous Operating Temp (C): Selectable
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