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IC Sockets for test and production

Current test solutions, like elastomerics or pogo pins, have their strengths and weakness's.

 

Low cost/Low frequency test fixtures have low yields and increased retesting. High cost/High frequency test fixtures work well but are expensive and have a limited lifespan.

Into the marketplace steps a new solution, a disruptive shift towards higher frequency, higher yields, longer life, less re-testing, less downtime, and an overall lower cost per test than ever before, DUT's "NiCarb" contact technology. 

DUT's NiCarb test fixture consists of a combination of several technologies utilizing standard PCB fabrications techniques at its foundation.

A close-up of a NiCarb bump shows the controlled stacking of particles to a desired height with clearance between individual particles.

Double Layer "C-Spring" Interposer

(Compressed)

Double Layer "C -Spring" Interposer

Single Layer "Cantilever Beam" Interposer

(Compressed Cross-Section)

Double Layer "C-Spring"  Interposer

(Compressed Cross-Section)

Cross-section of the NiCarb bump shows planarity of a single bump as well as planarity to the adjacent bump.

Insertion Cycle Life Study

Insertions inflict limited damage to the mating surface do to the extreme hardness of NiCarb (Mohs hardness 9 or above) in comparison to opposing materials. The fractal nature of the surface finish also allows for the penetration of oxides with a z axis wiping motion.

 

This, in combination with DUT's novel C spring concept, provides the longest re-mate life of any test fixture currently available.

 

Under certain design parameters the contact set has been tested to over 3,000,000 test cycles without a significant reduction in the electrical performance.

Contact Technology Comparison Chart

Please find below a comparison chart detailing DUT's unique advantages over industry alternatives

Industry leading frequency bandwidth, repeatability and longevity

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Guaranteed solderability of tested devices

+

Reduced maintenance requirements

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Significant yield improvements  & Improved bottom line